Many engineers are asking: how much better is RV1126B than RV1126, and which should a new project choose? This article breaks down the core differences between the two chip generations and shows the real value of the upgrade.
▍CPU Upgrade
RV1126B upgrades from 4x Cortex-A7 @ 1.5GHz to 4x Cortex-A53 @ 1.75GHz, delivering a substantial boost in baseline compute performance. Concurrent workloads no longer stutter, and there is far more headroom for software ecosystem expansion.
▍NPU Compute Leap
RV1126B increases NPU compute by 50%, enabling deployment of higher-precision, larger-scale AI models. It supports parallel inference of multiple AI tasks and accommodates more complex algorithm scenarios.
▍AOV Ultra-Low Power
RV1126B features AOV 3.0 with low-power recording capability, making it well suited to security surveillance and battery-powered devices. It offers clear advantages in wake-up snapshot and long-duration standby recording scenarios.
Measured data shows that AOV low-frame-rate mode saves up to 90%+ energy versus normal frame-rate mode. Rockchip's low-power recording technology makes large-scale deployment of machine-vision devices far more power-efficient.
▍AI-ISP On Board
RV1126B integrates a dedicated AI-ISP hardware unit whose processing does not consume NPU compute - the entire NPU budget stays available for AI algorithms. Image-quality optimization and AI inference run in parallel, with more efficient resource scheduling.
▍Richer Interfaces
Ethernet: RV1126B supports 1x GMAC or 1x CPU-integrated FEPHY interface. During hardware design the 100M Ethernet port can be routed out directly, eliminating an external PHY, simplifying PCB design, lowering BOM cost, and improving overall system stability.
CAN FD: RV1126B supports 2x CAN FD channels with higher transfer rates, larger payload frames, and stronger interference immunity, meeting the field-bus communication requirements of automotive and industrial applications.
USB: RV1126B supports USB 3.0, greatly increasing bandwidth and enabling high-speed external storage and high-speed camera connectivity. Peripheral data transfer is no longer a bottleneck, making video backhaul and large-volume data export more efficient.
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Thinkcore Team is an embedded board solution provider, developer, and motherboard supplier, specializing in the design, manufacturing, sales, and technical sharing of embedded motherboards. Our chipset portfolio includes Rockchip, Allwinner, and others. We welcome inquiries and collaboration!
mail: developer@thinkcore.cn
We have also launched products related to RV1126B, including RV1126B IPC board, RV1126B BTB SOM core board, and RV1126B stamp hole SOM core board. You can visit the following link or contact us to obtain the relevant information.
RV1126B IPC board：
http://www.think-core.com/product/detail/23/112
https://www.thinkcorearm.com/rockchip-rv1126b-smart-ip-camera-module.html
https://www.thinkcorearm.com/rv1126b-p-ipc.html
RV1126B BTB SOM core board：
https://www.thinkcorearm.com/rv1126b-som-ipc-core-board-38mm-btb.html
RV1126B stamp hole SOM core board：
https://www.thinkcorearm.com/rockchip-rv1126b-som-stamp-hole-core-board.html