TC-RV1126 Stamp Hole Core Board (RV1126 SOM) Brief
TC-RV1126 Stamp Hole Core Board (RV1126 SOM) takes Low-consumption AI vision processor Rockchip RV1126, with 14nm lithography process and quad-core 32-bit ARM Cortex-A7 architecture, integrates NEON and FPU — the frequency is up to 1.5GHz. It supports FastBoot, TrustZone technology and multiple crypto engines.
Built-in neural network processor NPU with computing power up to 2.0 Tops realizes that the power consumption of AI computing is less than 10% of the power required by the GPU. With tools and supporting AI algorithms provided, it supports direct conversion and deployment of Tensorflow, PyTorch, Caffe, MxNet, DarkNet, ONNX, etc.
With multi-level image noise reduction, 3F-HDR and other technologies, RV1126 not only ensures the dynamic range of the scene, but also meets the needs of outputting full color in darkness, making "clearly visible" a reality — more conforms to the actual demands in the security field.
Built-in Video CODEC supports 4K H.254/H.265@30FPS and multi-channel video encoding and decoding, meeting the needs of low bit rate, low-latency encoding, perceptual encoding and making the video occupancy smaller.
TC-RV1126 SOM takes stamp hole designed, its PCB takes 6-layers immersion gold designed, which is of strong scalability. The size is only 48mm*48mm, ups to 172PIN. Includes I2C, SPI, UART, ADC, PWM, GPIO, USB2.0, SDIO, I2S, MIPI-DSI, MIPI-CSI, CIF, PHY and other interfaces are equipped, meeting needs of more usage scenarios.
It supports Buildroot+QT OS — occupies small space, starts fast, and provides stable and reliable operation.Source codes are open.
TC-RV1126 development board includes TC-RV1126 som and carrier baord.
TC-RV1126 Stamp Hole Core Board (RV1126 SOM) Features：
l Size: 48mm x 48mm
l Low-consumption AI vision processor Rockchip RV1126, with 2.0 Tops NPU
l Supports 4K H.254/H.265@30FPS and multi-channel video encoding and decoding,
l Ups to 172pin, rich interfaces
l Supports Buildroot+QT OS — occupies small space, starts fast
l 1GB/2GB Lpddr4, 8GB/16GB eMMC storage
Application
It is widely used in face recognition, gesture recognition, gate access control, smart security, smart IP camera, smart doorbell/peephole, self-service terminals, smart finance, smart construction, smart travel and other industries.
Characteristic Parameter
Structure | |
Appearance | Stamp hole |
Size | 48mm*48mm*1.2mm |
PIN number | 172PIN |
Layer | 6 Layers |
System Configuration | |
CPU | Rockchip RV1126 Quad-core ARM Cortex-A7 32-bit, integrates NEON and FPU Each core has a 32KB I-cache, 32KB D-cache and 512KB shared second-level cache Based on RISC-V MCU |
NPU | 2.0Tops, supports INT8/ INT16， It has strong network model compatibility, can realize the conversion of commonly used AI framework models,eg: Tensor Flow/MXNet/PyTorch/Caffe/... |
RAM | 1GB/2GB lpddr4 |
Storage | 8GB/16GB eMMC |
Power IC | RK809-2 |
Video Encoding | 4K H.264/H.265 30fps video encoding: 3840 x 2160@30 fps+720p@30 fps encoding |
Video Decoding | 4K H.264/H.265 30fps video decoding: 3840 x 2160@30 encoding + 3840 x 2160@30 fps decoding |
System OS | Buildroot Linux |
Power Input | 5V/3A |
Hardware Features | |
Ethernet | Supports 10/100/1000M Ethernet, With TSO(TCP Segmentation Offload) network acceleration |
Wifi | Via SDIO 3.0 interface |
Display | Supports MIPI-DSI interface 1080P @ 60 FPS |
Audio | 8-channel I2S with TDM/PDM, 2-channel I2S |
Camera | Supports 3 cameras simultaneous input: 2 groups of MIPI CSI (or LVDS/sub LVDS) and 1 group of DVP (BT.601/BT.656/BT.1120) Supports 14M ISP 2.0 with 3-frame HDR(Line-based/Frame-based/DCG)
|
Interface | USB 2.0 OTG , USB 2.0 host 1000M Ethernet port, with TSO(TCP Segmentation Offload) network acceleration SDIO 3.0×2 (for Wi-Fi and SD card) 8-channel I2S with TDM/PDM, 2-channel I2S UART×6, SPI×2, I2C×6, GPIO, CAN, PWM |
Electrical Specification | |
Input Voltage | 5V/3A |
Storage Temperature
| -30~70℃ |
Working Temperature
| -20~60 ℃ |
